Advanced inspection services for hidden solder joints
We provide professional X-Ray inspection services for BGA, QFN, and other hidden solder joints. Our 3D X-Ray systems enable detailed inspection of internal structures ensuring highest quality standards.
Our state-of-the-art X-Ray inspection facility is equipped with advanced 2D and 3D X-Ray tomography systems that provide detailed internal views of solder joints and component connections. This non-destructive testing method is essential for quality control in modern electronics manufacturing.
Our X-Ray inspection services comply with international quality standards including IPC-A-610 and IPC-7091. We provide detailed inspection reports with high-resolution images and measurement data to support your quality documentation requirements.
+86 755 1234 5678
info@kexunda.com
Bao'an District, Shenzhen