+86 755 1234 5678 info@kexunda.com
Contact Us

About X-Ray Inspection

We provide professional X-Ray inspection services for BGA, QFN, and other hidden solder joints. Our 3D X-Ray systems enable detailed inspection of internal structures ensuring highest quality standards.

Our state-of-the-art X-Ray inspection facility is equipped with advanced 2D and 3D X-Ray tomography systems that provide detailed internal views of solder joints and component connections. This non-destructive testing method is essential for quality control in modern electronics manufacturing.

X-Ray Inspection Services

  • BGA Inspection & Analysis
  • QFN & DFN Inspection
  • 3D X-Ray Tomography
  • Void Analysis & Measurement
  • Solder Joint Quality Control
  • BGA Balling Services
  • Counterfeit Component Detection
  • Failure Analysis

Quality Standards

Our X-Ray inspection services comply with international quality standards including IPC-A-610 and IPC-7091. We provide detailed inspection reports with high-resolution images and measurement data to support your quality documentation requirements.

Contact Us

Phone

+86 755 1234 5678

Email

info@kexunda.com

Address

Bao'an District, Shenzhen